DHPC Technologies, Inc., a small business with long-standing support to the U.S. Army C4ISR community has been awarded a competitive small business set-aside contract to support the Army's Program Executive Office for Intelligence, Electronic Warfare and Sensors (PEO IEW&S) and its six subordinate Program Management (PM) offices under its Better Buying Support Services (B2S2) multiple [...]
DHPC has been awarded a full and open, competitive, multi-million dollar Task Order under its Technical Information Engineering Services (TIES) Multiple Award, IDIQ contract vehicle. The multi-year base, plus multi-year option contract task order award, entitled Facilities Integration and Laboratory Engineering Technical Support (FILETS) will provide advanced engineering solutions and services to CERDEC's Intelligence and [...]
DHPC has been awarded a full and open, competitive, multi-million dollar Task Order under its Technical Information Engineering Services (TIES) Multiple Award, IDIQ contract vehicle. The multi-year base, plus multi-year option Task award, entitled the Methods and Objectives for Near-term Survivability Testing and Engineering Resources (MONSTER) will provide advanced engineering solutions and services to CERDEC's [...]
Yakov Soskind is a recognized expert in the fields of photonic instrumentation, laser systems, and optical design. He has been bringing innovative ideas and concepts to successful implementation in the form of unique instruments and volume consumer products for more than 30 years. His article was published in SPIE called Diffractive optics technologies further advance [...]
DHPC and its team have been awarded a Technical Information Engineering Services (TIES) multiple-award, IDIQ prime contract with a multi-million dollar ceiling to support the U.S. Army's Intelligence and Information Warfare Directorate (I2WD) principally located at Aberdeen Proving Ground, MD.
On 4 May 2015, DHPC received a $50M SBSA contract, W56KGU-15-C-0029, to provide engineering services in support of the Army's Communications-Electronics Research, Development and Engineering Center.